Home · Lim, Hwa Kyung, Kim, Yongdai and Kim, Min-Kyoon (2017). Failure prediction using sequential pattern mining in the wire bonding process, IEEE Transactions on Semiconductor Manufacturing. 30, 285–292.
Home · Lim, Hwa Kyung, Kim, Yongdai and Kim, Min-Kyoon (2017). Failure prediction using sequential pattern mining in the wire bonding process, IEEE Transactions on Semiconductor Manufacturing. 30, 285–292.
Lim, Hwa Kyung, Kim, Yongdai and Kim, Min-Kyoon (2017). Failure prediction using sequential pattern mining in the wire bonding process, IEEE Transactions on Semiconductor Manufacturing. 30, 285–292.
